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Kuraray Noritake CLEARFIL™ SE Bond 2
Kuraray Noritake CLEARFIL™ SE Bond 2
Kuraray Noritake CLEARFIL™ SE Bond 2
Kuraray Noritake CLEARFIL™ SE Bond 2
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Kuraray Noritake CLEARFIL™ SE Bond 2

Regular price
RM552.50 MYR
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RM552.50 MYR
Regular price
RM650.00 MYR
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Kuraray Noritake CLEARFIL™ SE BOND 2: Two-Step Self-Etch Adhesive for Strong, Durable Bonding

Kuraray Noritake CLEARFIL™ SE BOND 2 is a clinically proven two-step, self-etch, light-cure bonding system designed to provide strong, durable adhesion with a simple and reliable clinical workflow. Building on the proven performance of the original CLEARFIL™ SE BOND, CLEARFIL SE BOND 2 features an enhanced catalyst system for increased bond strength and expanded versatility for direct restorations, indirect restorations, and core build-ups.

Powered by Kuraray Noritake’s original MDP monomer technology, CLEARFIL SE BOND 2 provides reliable chemical adhesion while delivering excellent marginal sealing and virtually no postoperative sensitivity. Its mild self-etching primer eliminates the need for a separate acid-etching and rinsing step, helping reduce technique sensitivity and simplify everyday restorative procedures.

Key Features of CLEARFIL™ SE BOND 2

Original MDP Adhesive Technology

Formulated with Kuraray Noritake’s original MDP monomer, CLEARFIL SE BOND 2 provides strong chemical interaction with calcium and hydroxyapatite, contributing to a stable hybrid layer and durable adhesion to tooth structure.

Two-Step Self-Etch System

The mild self-etching PRIMER simultaneously treats enamel and dentin without requiring a separate phosphoric acid etching or rinsing step, simplifying the bonding procedure and reducing technique sensitivity.

Strong and Durable Bonding

An enhanced catalyst system provides increased bond strength while maintaining the reliable marginal sealing performance associated with the CLEARFIL SE BOND system.

Low Technique Sensitivity

The self-etching approach requires less attention to the precise moisture level of the tooth surface compared with conventional wet-bonding techniques, helping create a more predictable clinical workflow.

Versatile Clinical Applications

CLEARFIL SE BOND 2 can be used for direct restorations as well as indirect restorations and core build-ups. When combined with CLEARFIL™ DC Activator, the bonding system can be used with dual-cure and self-cure composite materials and adhesive resin cements.

Thin, Uniform Bonding Layer

The system is designed to create a thin adhesive layer, making it suitable for indirect restorations where maintaining accurate restoration fit and morphology is important.

Reliable Marginal Sealing

CLEARFIL SE BOND 2 is designed to create a tight and durable marginal seal, supporting long-term restorative performance and helping minimize postoperative sensitivity.

Clinical Applications

  • Direct restorations using light-cured composite resin
  • Cavity sealing as a pretreatment for indirect restorations
  • Treatment of exposed root surfaces
  • Treatment of hypersensitive teeth
  • Intraoral repair of fractured restorations
  • Post cementation using dual-cure or self-cure composite resin
  • Core build-ups using light-, dual-, or self-cured core materials
  • Cementation of inlays, onlays, crowns, bridges, and veneers using adhesive resin cement

Advantages of CLEARFIL™ SE BOND 2 for Dentists

Simplified Workflow: Two-step self-etch application eliminates separate etching and rinsing steps.

Strong Adhesion: Original MDP technology provides reliable chemical adhesion to tooth structure.

Predictable Bonding: Mild self-etching helps reduce technique sensitivity and sensitivity to variations in surface moisture.

Versatile Use: Suitable for direct restorations, indirect restorations, post cementation, and core build-ups.

Excellent Sealing: Designed to provide a durable marginal seal for reliable restorative performance.

Low Film Thickness: Ideal for indirect restorative procedures where accurate seating and restoration fit are important.

How to Use CLEARFIL™ SE BOND 2

Prepare the Tooth Surface

Clean the tooth surface and isolate according to standard clinical procedures.

Apply PRIMER

Apply CLEARFIL SE BOND 2 PRIMER to the prepared tooth surface and leave for 20 seconds. Do not rinse.

Dry

Gently air-dry the PRIMER with mild airflow for approximately 5 seconds.

Apply BOND

Apply CLEARFIL SE BOND 2 BOND and distribute evenly using gentle airflow to create a uniform adhesive film.

Light-Cure

Light-cure the adhesive according to the manufacturer’s instructions before placing the restorative material.

For Indirect Restorations and Core Build-Ups

For indirect restorations and core build-ups, mix CLEARFIL SE BOND 2 BOND with CLEARFIL™ DC Activator according to the manufacturer’s instructions. Apply the mixture, gently air-dry, and light-cure if desired before proceeding with the appropriate adhesive resin cement or core build-up material.

Specifications

Type: Two-step self-etch, light-cure bonding agent

Technology: Original MDP adhesive monomer

Components: PRIMER + BOND

Additional Component: CLEARFIL™ DC Activator for dual-cure applications

Indications: Direct restorations, indirect restorations, post cementation, core build-ups, cavity sealing, and treatment of hypersensitive or exposed root surfaces

Curing Mode: Light-cure; dual-cure functionality when used with CLEARFIL™ DC Activator

Etching: Self-etch; no separate acid-etching or rinsing step required

Film Thickness: Designed for a thin adhesive layer suitable for direct and indirect restorative procedures

CLEARFIL™ SE BOND 2 combines Kuraray Noritake’s renowned MDP adhesive technology with a simple two-step self-etch workflow, delivering strong adhesion, reliable marginal sealing, and versatile clinical applications. With its enhanced bonding performance and compatibility with direct, indirect, and core build-up procedures, CLEARFIL SE BOND 2 is a dependable adhesive solution for modern restorative dentistry.

FOR PROFESSIONAL USE ONLY — EXCLUSIVELY FOR DENTAL PRACTITIONERS